郭新敬 Xinjing Guo

Ph.D. Candidate · Integrated Circuit Science and Engineering

Fudan University, Shanghai

gxjtriumph@icloud.com | (+86) 152-0176-7931 | Shanghai, China | ResearchGate
Xinjing Guo

Research Overview

Towards Reliability-Aware DTCO — building a multi-scale simulation chain from atomic defect structures through device degradation to circuit aging.

Forward Path

Starting from first-principles calculation of gate-dielectric defect properties, extending to large-scale systems via MLIP, predicting device-level ΔVth degradation through the All-state Model and the in-house simulator RASP, and reaching circuit-level aging & timing assessment through Compact Model development.

Inverse Path

Addressing the core DTCO question — "which defects dominate degradation?" — by developing defect density extraction methods based on inverse theory, recovering atomic-level defect parameters from electrical measurements to close the simulation-experiment loop.

Atomic Defects
DFT / MLIP
Device Reliability
All-state Model / RASP
Circuit Aging
Compact Model / HSPICE
Defect Parameter Extraction (Inverse Problem)

Education

Ph.D. in Integrated Circuit Science and Engineering
Fudan University
Sep 2022 – Present
B.Sc. in Physics Top Student Program (MOE)
East China Normal University
Sep 2018 – Jun 2022 · Ranked 1st
Minor in Mathematics & Applied Mathematics
Shanghai Jiao Tong University
Sep 2020 – Jun 2022

Research Achievements

2022 – Present

Atomic-Level Defect Property Simulation

1 paper · 1 software copyright · 2 commercial software
  • High-throughput defect calculation: Systematic first-principles study of intrinsic defect properties in SiO2, HfO2 and other gate dielectrics; established defect database.
  • Software development: Led development of ILED (Intelligent Learning Engine of Defects) for one-stop automated IC material defect property calculation; contributed to core modules of DASP (Defect & Dopant Ab-Initio Simulation Package).
2024 – 2025

ML-Accelerated Defect Property Calculation

1 paper
  • AI acceleration: Introduced MLIP to accelerate defect search, reducing computational cost to 7.36% of DFT while maintaining >96% accuracy.
2023 – Present

Device-Level Reliability Simulation Methods & Software

3 papers · 1 software copyright · 1 commercial software
  • High-throughput computation: Systematic study of oxygen vacancies in amorphous SiO2, discovering 7 stable configurations with wide energy distributions.
  • Model innovation: Proposed the "All-state Model" for Si/SiO2 MOSFETs, correcting critical errors in traditional models caused by missing defect paths in amorphous gate dielectrics. This model is being integrated into a leading domestic TCAD simulator.
  • Software development: Led development of RASP, enabling cross-scale reliability simulation from atomic defect parameters to device-level threshold voltage shifts.
2024 – Present

Defect Parameter Extraction from Electrical Measurements

In progress
  • Formulated BTI ΔVth degradation as a non-negatively constrained Fredholm first-kind integral equation inverse problem. Solved the ill-conditioned linear system via SVD analysis, Tikhonov regularization, and PLS dimensionality reduction to extract NMP defect density distributions from single-set electrical measurements.
2024 – Present

Circuit-Level Aging Compact Model Development

In progress
  • Model innovation: Developing MOSFET and FinFET circuit-level aging models based on the "All-state Model".
  • Atomic-resolution circuit aging simulation: Combining in-house defect parameter extraction methods with HSPICE to build a complete atomic-to-circuit aging simulation chain.

Software Development

RASP

Core Developer 2024 – Present

Reliability Ab initio Simulation Package

All-state model based reliability simulation package. Enables cross-scale simulation from first-principles defect parameters to device-level ΔVth prediction.

Documentation & User Manual

ILED

Core Developer 2023 – Present

Intelligent Learning Engine of Defects

One-stop automated IC material defect property calculation software (copyrighted). Integrates MLIP for rapid defect screening.

DASP

Contributor 2022 – 2023

Defect & Dopant Ab-Initio Simulation Package

Contributed to core modules. Now commercially deployed with 150+ users across academia and industry, including Huawei HiSilicon.

Selected Publications

  1. Xinjing Guo, Menglin Huang, Shiyou Chen. "Si/SiO2 MOSFET reliability physics: From four-state model to all-state model." Physical Review Applied 24, 044040, 2025.
  2. Xinjing Guo, Menglin Huang, Shiyou Chen. "RASP: Reliability ab initio simulation package of MOSFETs based on all-state model." Microelectronics Reliability, Under Review.
  3. Xinjing Guo, Menglin Huang, Shiyou Chen. "An overlooked origin of NBTI in Si based MOSFETs." IEEE Electron Device Letters, Submitted.
  4. Xinpeng Li*, Xinjing Guo*, et al. "Machine learning interatomic potentials accelerate defect exploration in amorphous silica." Physical Review Materials, 2025.
  5. Menglin Huang, ..., Xinjing Guo, et al. "DASP: Defect and Dopant Ab-Initio Simulation Package." Journal of Semiconductors 43, 042101, 2022.

Honors & Awards

National Scholarship Ministry of Education
CAS "Shangguang" Scholarship Chinese Academy of Sciences
"Internet+" Innovation Competition — National Gold 7th Edition, 2022
DB-SNUbiz Startup Challenge — Global 2nd Place Seoul National University, 2022
"Challenge Cup" — National Bronze 13th Edition
China International College Students' Innovation Competition — Silver Shanghai Division, 2025
Fudan "Zhuoyue Cup" — 1st Prize 2025
Annual Innovation Person, ECNU 2021
MCM/ICM Honorable Mention COMAP, 2020